山東力冠微電子裝備

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?適用領(lǐng)域:集成電路、先進(jìn)封裝 Relevant Industries: Integrated Circuits, Advanced Packaging ?適用材料:Si、SiC Suitable for Processing: Silicon (Si), Silicon Carbide (SiC) ?晶圓尺寸:12/8 英寸 Wafer Size: 12/8 inch ?適用工藝:Si3N4 、SiO2等膜層的沉積 Deposition of Si3N4, SiO2, and other film layers

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